Questions & Answers

GOB stands for Glue-On-Board. It is a post-assembly surface encapsulation process in which a transparent two-part epoxy resin is dispensed across the entire active surface of an SMD LED module, covering and sealing every LED chip, bond wire, and solder joint under a single continuous protective layer.

The cured resin is optically clear (≥92% light transmission), mechanically tough (Shore A 75–85), and chemically inert — providing IP68 waterproofing, IK08 impact resistance, UV stability, and corrosion protection simultaneously from a single processing step.

Conformal coating applies a thin film (typically 25–200 μm) over the PCB surface, primarily for moisture resistance. It does not provide meaningful impact protection, and its thin coverage over bond wires leaves them exposed to mechanical stress.

GOB applies a bulk resin layer 0.3–1.5 mm thick that fully encapsulates every LED die and bond wire in a rigid polymer matrix. The result is genuine die-level sealing, not surface-level moisture resistance. Key differences:

• Impact resistance: GOB achieves IK08 (5 joule); conformal coating provides essentially none.
• Bond wire protection: GOB fully encases bond wires; conformal coating provides thin, incomplete coverage.
• IP rating: GOB achieves IP68; conformal coating typically reaches IP54–65 depending on application method.
• Repairability: Conformal coating can be stripped and resoldered; GOB is not fully repairable — limited rework only.

In practice, no measurable brightness reduction occurs with a correctly formulated and applied GOB resin. The resin’s refractive index (1.50–1.52) closely matches the LED package encapsulant (typically 1.48–1.54), minimising Fresnel reflection losses at the interface. Measured light transmission is ≥92–93% in the visible spectrum.

Customers who report larger apparent brightness differences when comparing GOB and bare-SMD modules from the same batch are typically observing luminous flux bin variation between production lots — not a GOB-induced loss. We recommend photometric measurement under controlled conditions before and after GOB processing if brightness consistency is a concern for your application.

The effect is minimal. Due to refractive index matching at the resin–LED package interface, far-field emission pattern is largely preserved. Some customers observe a marginal 2–3° widening of the 50% intensity angle — a slight increase in lambertian distribution. This is generally considered neutral or slightly positive for most viewing angle applications.

The matte surface finish option produces slightly more diffuse emission at oblique angles, which can reduce hot-spot glare in high-ambient-light retail environments.

The encapsulant itself does not degrade under normal operating conditions within the warranty period of the LED modules. Our accelerated aging tests show:

• UV stability: Δb* <1.2 yellowing index after 2,000 hours QUV-A (equivalent to 5–8 years outdoor UV exposure depending on location)
• Thermal cycling: No cracking or delamination after 500 cycles (−40°C to +85°C)
• Adhesion: No delamination observed in any in-service GOB modules across our customer base after 4+ years deployment

GOB-protected outdoor advertising displays are consistently reaching 7–10 year service lives where bare SMD installations required module replacement at 3–4 years. Delamination, when it occurs, is almost always attributable to surface preparation failures or cure process deviations — not to the resin formulation itself.

Standard formulation (Shore A 75–85): A bisphenol-A epoxy system optimised for indoor and general-purpose applications. Higher hardness provides excellent impact resistance. Operating range −30°C to +80°C. Recommended for indoor fine-pitch, retail, rental staging, and indoor sports.

High-flex formulation (Shore A 55–70): A cycloaliphatic epoxy with flexibiliser, optimised for outdoor, coastal, and extreme temperature environments. Lower glass-transition temperature maintains elasticity at sub-zero temperatures, preventing micro-cracking during thermal cycling. Operating range −40°C to +85°C. Enhanced UV stabiliser package rated to 2,000+ hours QUV. Recommended for outdoor advertising, perimeter boards, and any installation in harsh or marine environments.

If you are unsure which formulation is appropriate for your application, tell us the installation environment in your quote request and we will recommend the right option.

Submit a quote request via the form on our Services page or email us at info@gobfactory.com with the following:

Module type and pixel pitch
Quantity (modules)
Target delivery date
Application environment (indoor / outdoor / rental)
Module datasheet if available
We respond within 24 hours with pricing, lead time, formulation recommendation, and a production slot confirmation. After you confirm, we provide a shipping address and intake reference number. Ship your modules to us, and we return them GOB-processed with a batch QC report.

No minimum. We process orders from a single module (for evaluation or sampling purposes) up to 500,000+ modules per month. Pricing for very small quantities is higher due to fixed setup and intake costs, but we do not turn away small orders.

If you are a first-time customer evaluating our process, we actively encourage a small sample run (10–50 modules) before committing to a production batch. This costs more per unit but gives you a verified result on your specific module type before you invest in a large order.

• Sample / Prototype: 24 hours from module receipt
• Standard processing: 72 hours from module receipt
• Express processing: 48 hours from module receipt (subject to availability — confirm at quote stage)
• Mass production (>100,000 pcs): Quoted individually — typically 5–10 business days depending on queue

Turnaround is measured from intake to dispatch, not including inbound and outbound shipping transit time. We recommend factoring in 2–4 days additional time for international shipments each way.

We provide processing services only. We do not manufacture, stock, or sell LED modules. You supply your own modules from whatever manufacturer you use, we GOB-encapsulate them and return them to you.

This means you retain full control over your module supplier, LED binning, and module specification. We add one processing step — encapsulation — to modules you have already specified and sourced.

Yes to both. Facility visits are welcome by appointment — contact us to schedule. Third-party quality audits can be arranged; we routinely host customer audits and have supported ISO 9001 supplier qualification processes. Please give us at least 5 business days’ notice for audit visits.

Yes. We sign mutual NDAs for customers who require confidentiality around their module designs, supplier relationships, or project details. Standard NDA turnaround is 1–2 business days. Contact us to request our template NDA or to send yours for review.

We support P0.9 through P10. Pitches in regular production with optimised parameters: P0.9, P1.2, P1.5, P1.8, P3, P3.9, P4, P5. All other pitches from P2 to P10 are supported but may require a brief compatibility check before the first production run.

Fine-pitch modules (P0.9–P1.5) require a dedicated process with vacuum degassing and reduced dispense depth. Please specify your pitch in the quote request so we can schedule the correct line and confirm parameters.

• Supported: Indoor SMD (FR4 or aluminum base), outdoor SMD (FR4 or aluminum base), rental / die-cast aluminium frame modules
• Fine-pitch process required: P0.9–P1.5 — compatible with adjusted parameters (vacuum degassing, reduced depth)
• Limited support: Flexible / bendable modules — high-flex formulation supports bend radius ≥500 mm only; contact us before shipping
• Not supported: COB (Chip-on-Board) modules — the die bonding and surface topology of COB is not suitable for our current process

If your module type is not listed above, email us a datasheet or photos before shipping. Most non-standard formats can be accommodated after a short evaluation batch.

Yes. GOB processing is a post-assembly surface treatment — it is independent of the LED chip brand, driver IC, or PCB manufacturer. We process modules from all major LED display manufacturers without preference.

The only compatibility variable is the PCB substrate material (FR4 vs. aluminium base) and the module surface geometry. Both are handled in our standard process. Modules with non-standard protective coatings already applied may require surface preparation review — include a note in your quote request if your modules have any pre-existing surface treatment.

Partially. Standard rigid-cure resin (Shore A 75–85) will crack under bending — it is not suitable for flexible modules. Our high-flex formulation (Shore A 55–70) accommodates bend radii down to approximately 500 mm in service.

For tighter radii, mesh LED products, or modules designed for continuous curvature, please contact us before shipping. These applications are outside our current standard process scope, but we can evaluate specific module types on a case-by-case basis.

Our standard dispensing equipment handles modules up to 320 × 160 mm per unit. This covers the vast majority of standard LED display module formats. For oversized modules or panel-level encapsulation, contact us to discuss feasibility — some formats can be accommodated with fixture modifications.

We quote per-module pricing based on your specific parameters. The primary pricing drivers are:

• Pixel pitch (high impact) — finer pitches require slower dispensing, vacuum degassing, and more precise cure scheduling. P0.9–P1.5 carries a fine-pitch premium; P3 and above is standard rate.
• Batch quantity (high impact) — setup and intake costs are fixed; larger batches amortise these across more modules. ignificant price breaks at 5K, 20K, and 100K modules.
• Resin formulation (medium impact) — high-flex formulation carries approximately 15–20% material premium over standard.
• Service tier (medium impact) — express (48 hr) carries a priority surcharge; sample runs are flat-rate regardless of quantity.
• Resin depth (low impact) — increased depth (1.0–1.5 mm) uses more material; minor cost difference.

Submit a quote request with your pitch, quantity, and service tier and we will respond with a firm price within 24 hours.

We do not publish a public price list, because per-module pricing varies significantly based on pitch, quantity, and formulation — a P0.9 sample run and a P6 mass production order are priced very differently. Publishing a single number would be misleading for most customers.

Quote requests are free and we respond within 24 hours. For customers who need a budgetary estimate before committing to a formal request, email us with your approximate pitch and quantity and we will provide a ballpark range by return.

There are no separate setup fees. Fixed setup and intake costs are built into the per-module price. For very small batches (under 50 modules), a minimum batch charge applies, which we will quote explicitly — this prevents situations where the per-module price looks reasonable but the total comes to less than the minimum viable batch cost.

First-article evaluation (for new module types) is included in the per-module price for orders above 500 modules. For smaller quantities being processed for the first time, a first-article assessment fee may apply — we will confirm this at the quote stage.

We accept bank transfer (T/T), PayPal, and major credit cards. Payment terms for new customers are typically 50% deposit on order confirmation, 50% before dispatch. Established customers with a track record may qualify for net-30 terms — this is assessed on a per-account basis after the first two orders.

For large orders (100,000+ modules), a payment schedule tied to production milestones can be arranged. Discuss this at the quote stage.

Before shipping, confirm your order and receive an intake reference number from us. This number must be written clearly on the outer carton. We accept shipments from all major couriers (DHL, FedEx, UPS, EMS, and standard freight).

Packing guidelines:

• Use anti-static bags or foam-lined trays for individual modules — do not ship loose
• Package different module types separately, each labelled with module type and pixel pitch
• Include a printed copy of the order confirmation or a packing list inside the carton
• For fine-pitch modules (P0.9–P2), use rigid cell trays rather than bulk padding

International shipments: Declare contents as “LED display modules for processing/repair” and list accurate commercial value. Do not declare as gift or undervalue — this causes customs delays on return shipment and can result in duty assessment issues.

Yes. We coordinate return shipping on your behalf. At the quote stage, confirm whether you want us to arrange return courier (cost added to invoice) or whether you will provide a prepaid return label. For international customers, we typically arrange return via DHL Express or FedEx International Priority.

Modules are individually sleeved and packed in the same or equivalent packaging to what they arrived in. A batch QC report PDF is emailed to you on or before the dispatch date.

Yes. We process modules from customers worldwide. There are no geographic restrictions on inbound shipments. For international customers, we recommend using a courier with full customs documentation support (DHL, FedEx, or UPS) rather than standard postal services — the latter can introduce unpredictable customs delays.

We can provide a formal processing service letter on letterhead if required for customs clearance in your country on inbound or return shipment.

Yes. We offer secure on-site storage for up to 14 days before processing (if you need to ship ahead of your scheduled production slot) and up to 14 days after processing (if you need to delay return shipment). Storage beyond 14 days can be arranged for an additional fee — confirm at quote stage if you anticipate needing extended storage.

Every standard production batch goes through seven quality checkpoints:

• Incoming inspection: Visual check and electrical power-on test per module before processing begins
• In-process cure monitoring: UV dose measured per batch; thermal cure profile logged every minute
• Dispense depth spot-check: 3–5 modules measured post-dispense, pre-cure
• Visual inspection: 100% — 10× magnification, transmitted light for bubble detection
• Surface adhesion check: 100% edge probe test
• Electrical burn-in: 100% — all modules powered at rated current for 4 hours minimum
• IP68 waterproof test: Sampling (5 pcs per 500 or 1% of batch), IEC 60529, 1 m / 30 min submersion

Impact testing (IK08) and Shore A hardness checks are performed on a sampling basis per batch. Full protocol details are on our Quality page.

Every shipment is accompanied by a batch QC report containing:

• Order reference, module identification, batch quantity, and processing dates
• Incoming inspection result — defect count, photos of any pre-existing damage
• Process parameters log — resin lot, UV dose, thermal cure profile
• Visual inspection summary — pass/fail count and defect type breakdown
• IP68 test result — sample size, protocol reference, pass/fail per sample
• Electrical aging test result — burn-in duration, failure count, final pass rate
• Outgoing summary — shipped quantity, reject count, shipment tracking reference

All incoming modules are documented with photos and an electrical test result before processing begins. If a module is damaged during our handling or processing — a processing-induced pixel failure, a physical damage event, or any defect not present at incoming inspection — we take full responsibility. We will replace the module or compensate at the agreed module value.

Pre-existing defects documented at incoming inspection are not our liability. This is why the incoming inspection step is shared with the customer before processing begins — so there is no ambiguity about the source of any failure discovered post-processing.

Yes. All process-critical and test instruments are on a documented calibration schedule. Key instruments and calibration frequency:

• UV radiometer — calibrated annually, third-party laboratory
• IP68 submersion tank — calibrated annually, third-party
• Thermal oven temperature loggers — calibrated annually
• Contact profilometer (depth measurement) — calibrated semi-annually
• Shore A durometer — calibrated annually

Calibration certificates are available on request for any instrument used in a specific batch.

The epoxy resin adds a small thermal resistance to the heat path from LED junction to ambient. Resin thermal conductivity is typically 0.2–0.3 W/m·K, lower than the convective heat transfer from a bare LED surface. In practice, junction temperature increase is negligible at standard operating currents — typically <3°C at full brightness on a well-designed PCB.

For high-brightness outdoor modules operating at elevated drive currents (above 80% rated current), we recommend aluminum-base PCBs, which provide a lower-resistance lateral heat path that more than compensates for the resin’s thermal resistance contribution. On FR4 substrates at high drive currents, a thermal review is advisable before committing to GOB on a new module type.

Limited rework is possible. Single-LED replacement requires mechanical removal of the resin over the failed pixel — typically using a precision hot-air tool and micro-chisel under magnification. The failed LED is then replaced, and the reworked area is re-potted with fresh resin and cured.

This is feasible for isolated failures but requires skilled technicians and appropriate tools. It is not practical for widespread pixel failures. Most GOB display operators use a module-swap maintenance model rather than pixel-level repair in the field.

We offer a rework service for GOB modules with isolated failures — see our Services page for details. Feasibility depends on module type and defect location; contact us with photos for an assessment before shipping.

Yes, with dedicated process adjustments. Fine-pitch modules require:

• Vacuum degassing — applied at −0.09 MPa to eliminate sub-surface bubbles that would be visible as bright spots or halos on close-viewing-distance displays
• Reduced dispense depth — 0.3–0.5 mm (vs. 0.8 mm standard) to preserve the pixel-level surface detail required for fine-pitch optical performance
• Slower dispensing speed — reduced approximately 40% to prevent surface turbulence that causes micro-bubbles
• Lower cure temperature — 60°C (vs. up to 80°C for standard) to avoid thermal stress on fine-pitch dies

We have a dedicated fine-pitch process line for P0.9–P1.5. For customers processing a fine-pitch module type for the first time, we strongly recommend a 10–20 module sample run before committing to production — the parameters are tuned per module type and a verified sample eliminates risk.

Standard formulation is rated to −30°C. For installations in Siberian, Scandinavian, Canadian, or high-altitude environments where temperatures regularly fall below −30°C, specify the high-flex formulation, rated to −40°C.

The high-flex formulation has a lower glass-transition temperature (Tg), meaning it remains elastomeric at sub-zero temperatures rather than becoming brittle. This prevents the micro-cracking and delamination at the resin–PCB interface that standard formulation can exhibit in extreme cold during thermal cycling. In our 500-cycle thermal test (−40°C to +85°C), neither formulation shows cracking or delamination — but for continuous field exposure below −30°C, the high-flex formulation is the correct specification.

Delamination — separation of the resin layer from the PCB substrate — is the most common GOB quality failure mode. The root causes are almost always process-related, not formulation-related:

• Inadequate surface preparation: Moisture in the PCB, surface oils, or insufficient plasma treatment reduce adhesion. Our dehumidification bake and plasma treatment step directly addresses this.
• Incorrect cure: Undercured resin has lower adhesion strength. Our UV dose measurement and thermal profile logging catch cure deviations before dispatch.
• Incompatible substrate: Some PCB surface finishes (certain ENIG or OSP variants) have lower epoxy adhesion. First-article inspection on new module types catches this before production.
• Thermal mismatch: Excessive thermal cycling range beyond the formulation’s rated specification. High-flex formulation for outdoor applications addresses this.

Our in-service delamination rate across all processed modules is under 0.1%. When delamination does occur, it is almost always traceable to a process deviation logged in the batch record, which is why we retain all batch data for 5 years.

No. The epoxy resin is an electrical insulator — it does not affect drive current, forward voltage, PWM response, or any other electrical parameter of the LED module. Connector access points are masked during processing and remain fully accessible after encapsulation.

The one indirect electrical consideration is thermal — see the heat dissipation question above. If junction temperature increases slightly (which is only significant at very high drive currents), the forward voltage will decrease marginally and efficiency may change by a fraction of a percent. Under normal operating conditions, this is not measurable.