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GOB Encapsulation Processing

Protect Your LED Modules

We process your bare LED display modules with industrial-grade GOB (Glue-On-Board) encapsulation — IP68 waterproofing, impact resistance, and anti-UV protection at scale.
Glue on board led display
  • IP30

    Waterproof rating

  • 0hr

    Standard turnaround

  • 0K+

    Modules processed

What is GOB?

Glue-On-Board encapsulation explained

GOB is a surface encapsulation process in which a transparent epoxy resin is precisely dispensed across the entire PCB surface, fully encasing the LED chips, bond wires, and solder joints in a single protective layer.

  • Unlike conformal coating, GOB achieves full physical encapsulation.
  • The optically clear resin maintains high light transmission with no visible color shift or brightness loss.
  • Processing is done on your existing modules — no hardware redesign or new PCB layout required.
  • Compatible with standard SMD LED modules across all common pixel pitches used in LED display manufacturing.

  • Encapsulant type

    Two-part optical epoxy resin

  • Light transmission

    ≥ 92%

  • IP rating achieved

    IP65 / IP67 / IP68

  • Shore hardness

    70–90 Shore A (adjustable)

  • Operating temp

    −40°C to +80°C

  • UV resistance

    1,000+ hours (QUV test)

  • Adhesion

    PCB, FR4, aluminum substrate

  • Resin layer depth

    0.3 mm – 1.5 mm (customizable)

  • Custom resin formulations are available for extreme temperature ranges, high-humidity marine environments, and rental-grade flexibility requirements.

Protection performance

Why GOB outperforms standard SMD

Four failure modes eliminated by a single encapsulation step.

  • IP68 waterproof

    Full encapsulation blocks all moisture ingress. Suitable for outdoor installations, car washes, stadiums, and high-humidity environments.

  • Impact & abrasion resistant

    The resin layer absorbs mechanical shock and surface abrasion, eliminating LED die damage during transport, installation, and rental handling.

  • Anti-UV & yellowing

    UV-stabilized epoxy formulation resists solar degradation and color yellowing, maintaining consistent white-point stability over thousands of operating hours.

  • Dust & corrosion proof

    Sealed surface prevents fine dust ingress and protects bond wires from oxidation in coastal, industrial, or chemically corrosive atmospheres.

Processing workflow

From bare module to GOB-protected — in five steps

Turnaround options include 72-hour standard, 48-hour express and 24-hour sample service with no MOQ and a monthly capacity of over 500,000 pieces; we accept customer-supplied modules, arrange return shipping and provide full batch tracking.

  • Module intake & incoming inspection

    We receive your shipment, log each batch, and perform visual and electrical incoming QC to document the pre-processing condition of every module.

  • Surface
    preparation

    Ultrasonic cleaning, dehumidification bake (typically 60°C / 4 hr), and plasma surface treatment to maximize epoxy adhesion to the PCB surface.

  • Precision resin
    dispensing

    Automated dispensing equipment applies the two-part epoxy to a controlled, uniform depth across the module surface — eliminating air pockets and uneven coverage.

  • Controlled
    curing

    Multi-stage UV + thermal cure cycle ensures full cross-linking of the epoxy matrix. Temperature and duration are profiled per resin formulation and PCB substrate type.

  • Outgoing
    QC & dispatch

    Optical inspection, drop test sampling, waterproof test verification, and full electrical aging test. Modules are packaged and returned with a batch quality report.

Why GOBfactory

Built for LED display manufacturers

  • Dedicated GOB processing facility

    GOB encapsulation is our sole focus — not a side service. Every piece of equipment, every process, and every technician is optimized for this single operation.

  • No minimum order — prototype to mass production

    Whether you’re evaluating GOB on a single cabinet or running a 200,000-module production order, we handle both with the same process discipline and QC standard.

  • Broad module compatibility

    P0.9 through P10, indoor and outdoor rated, FR4 and aluminum PCB substrates. Submit your module spec — we confirm compatibility before accepting the order.

  • Transparent quality documentation

    Every batch ships with a QC report: incoming inspection photos, process parameters log, outgoing test results, and pass/fail rate. No surprises on delivery.

Applications

Where GOB-protected displays are deployed

GOB encapsulation is the preferred surface protection wherever LED displays face physical handling, weather exposure, or long-term outdoor operation.

Outdoor advertising LED Display

Outdoor advertising

GOB shielding blocks rain, dust and sunlight to sustain reliable outdoor advertising screen operation year-round.

Rental & staging

Rental & staging

Tough protective layer avoids damage from repeated transport, assembly and heavy on-site event use.

Sports venues

Sports venues

Impact-proof surface withstands splashes and crowd contact for durable stadium and arena LED visuals.

Retail & hospitality

Retail & hospitality

Stain-resistant smooth coating simplifies daily cleaning for shopping and hotel digital signage.

Transportation displays

Transportation displays

Sealed encapsulation repels dust and humidity for long-lasting transit passenger information screens.